Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.
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Lehekülgede arv322 lehekülge
Lugemise aeg10:44 tundi
Arvutus põhineb keskmisel lugemiskiirusel, kus 200-250 sõna lugemiseks kulub 2 minutit.